French resource Nowhereelse motherboard unveiled photos of the iPhone 6. Spread passing shots sources have confirmed some of the specifications of the future flagship. What insiders told, was not something new: Apple will change the form factor of the new iPhone, and enable the device to support new interfaces.
Published today on the web images displayed circuit board iPhone 6, which is said to differ significantly on the shape and arrangement of similar component parts iPhone 5s. It is reported that it is somewhat longer. Aligning the image of the motherboard with the images back cover iPhone 6, a source confirmed their compliance with: the same holes for mounting the board to the housing unit.
Post a snapshot publication argues that the motherboard bears signs of the iPhone built-in NFC-6 module that will allow for contactless payments, as well as supporting communication standard Wi-Fi 802.11ac, theoretically doubling the performance of conventional configurations.
Now Apple is in full swing preparing for the autumn launch iPhone 6. And 4.7-inch version of the new flagship, as reported on the eve of Chinese sources, has already gone into mass production. Smartphone is on the assembly lines Foxconn, which explains the large number of leaks lately. While supply is extremely small, but before the end of August Apple partners are going to significantly increase the production volume of the new flagship.
As for the version of the iPhone 6 with 5.5-inch display, its assembly will begin in September.At the same time starts mass production of tablets iPad Air 2 and iPad mini third generation, whose debut is scheduled for October.